| Water Fabrication |
| • |
Wet Chemical
Application-Flow Analysis |
| • |
Water Belt Transport
Optimization |
| • |
Water Handling in Transfer
Areas/Indexing Docks |
|
| Product Testing |
| • |
Vibration and Impact
Analysis |
|
|
Case Study -
Microelectronics Impact Testing |
| • |
Drop Testing |
|
|
Case Study -
Microelectronics Product Testing |
| • |
Packaging Evaluation |
| • |
Interaction of Parts |
| • |
Quality Assurance |
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| Wire Bonding |
| • |
Characterization of Bond |
| • |
Trajectory of Wire Path |
| • |
Time/Motion Modeling of
Bonding Machine
- Optimize Performance
- Set Guidelines for P.M. |
| • |
Diagnosis of Machine Failure |
| • |
R&D of Bond/Timing
Relationships |
| • |
Increase Machine Performance
and Yield |
| • |
Analysis of Ball Formation |
|
| Component Insertion
& Surface Mount |
| • |
Diagnosis of Machine Failure |
| • |
Time/Motion Modeling of
Performance |
| • |
Design
Improvements-Modification of Parts |
| • |
Training Tool for Operator |
| - Top of the page - |
| Machine Design |
|
|
Video
- Machine design & diagnosis |
| • |
Accelerated Machine Design |
| • |
Improved Performance |
| • |
Failure Diagnosis |
| • |
Timing of Solenoids and
Other Movements |
| • |
Contact Probe Analysis |
| • |
Component Marking and
Identification |
|
| Vendor Equipment
Evaluation |
| • |
Evaluate New
Machines/Prototypes |
| • |
Diagnose/Identify Problem
Areas to Vendor |
